Inficon Maxtek PM-700 Plating Monitor Bedienungsanleitung PDF herunterladen (Seite 5)

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4.4.5.6 A-B)% Display ................................................................................................................ 27

4.4.6 Simulation Mode..........................................................................................................27

4.5 PARAMETERS.....................................................................................................................27

4.5.1 Viewing and modifying ................................................................................................27

4.5.2 Hidden parameters.......................................................................................................28

4.5.3 Descriptions.................................................................................................................28

4.5.3.1 Mode Menu ..................................................................................................................... 30

4.5.3.2 Process Menu .................................................................................................................. 32

4.5.3.3 Bath Menu.......................................................................................................................34

4.5.3.4 Display Menu .................................................................................................................. 36

4.5.3.5 Setup Menu ..................................................................................................................... 37

4.5.4 Restoring to Default Values.........................................................................................39

4.6 STATUS ASSESSMENT ........................................................................................................39

4.6.1 Monitor Status..............................................................................................................39

4.6.2 Probe Status.................................................................................................................39

4.7 SWAPPING PROBES.............................................................................................................40

4.7.1 Manual probe swapping ..............................................................................................40

4.7.1.1 Assessing the probe status prior to initiating the swap.................................................... 40

4.7.1.2 Preplating prior to swapping............................................................................................ 40

4.7.1.3 Commanding the swap. ................................................................................................... 40

4.7.1.4 Deplating the Standby Probe........................................................................................... 40

4.7.1.5 Manual termination of Preplate or Deplate on the Standby probe................................... 40

4.7.2 Automatic probe swapping ..........................................................................................41

4.7.2.1 Auto probe swap on active probe failure. ........................................................................ 41

4.7.2.2 Alternating Probe mode................................................................................................... 41

4.7.2.3 Failed Standby Probe inhibits automatic swap. ............................................................... 41

4.8 EXTERNAL INTERFACE.......................................................................................................41

4.8.1 Discrete Inputs.............................................................................................................41

4.8.2 Discrete Outputs ..........................................................................................................43

4.8.3 Digital to Analog Converters.......................................................................................45

4.8.3.1 Thickness DAC................................................................................................................ 45

4.8.3.2 Rate DAC ........................................................................................................................45

4.8.4 Computer Connection..................................................................................................47

4.8.4.1 RS-232 Interface.............................................................................................................. 48

4.8.4.2 Protocol ........................................................................................................................... 48

4.8.4.3 Remote Control ............................................................................................................... 49

4.8.4.3.1 Upload Parameter Store (Instruction 10h).................................................................. 49

4.8.4.3.2 Restore Parameter Store (Instruction 20h) ................................................................. 54

4.8.4.3.3 Remotely Activate (Instruction 30h) .......................................................................... 54

4.8.4.4 Remote Monitoring ......................................................................................................... 55

4.8.4.4.1 Upload Machine Status (Instruction 40h) .................................................................. 55

4.8.4.5 Data Logging................................................................................................................... 59

4.8.4.5.1 Establish automatic data logging................................................................................ 59

4.8.4.5.2 Single data log............................................................................................................ 62

5. TROUBLESHOOTING......................................................................................................63

5.1 TROUBLE-SHOOTING AIDS.................................................................................................63

5.2 FAIL MESSAGES FOLLOWING POWER ON...........................................................................64

5.2.1 Power Failure..............................................................................................................64

5.2.2 Sensor Probe Failure...................................................................................................65

5.2.3 Invalid Parameters.......................................................................................................65

5.2.4 RAM Failure ................................................................................................................65

5.2.5 ROM Failure................................................................................................................65

5.3 PROBE FAILED INDICATION................................................................................................65

6. APPENDIX ..........................................................................................................................67

6.1 THEORY OF THE QUARTZ CRYSTAL MICROBALANCE ........................................................67

6.1.1 Crystal Frequency........................................................................................................67

6.1.2 Crystal Health Calculation ..........................................................................................67

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